| Hole drilling |
NC hole drilling |
Φ 0.1 mm |
 |
| |
PTH hole |
Φ 0.2
mm |
| |
Drilling hole in punching |
Φ 0.5
mm |
|
| Trace |
Single-sided boards |
Width 50 μm / Pitch 50
μm |
| Width/Pitch |
Double-sided boards |
Width 75 μm / Pitch 75
μm |
|
| Lamination |
Coverlay |
± 0.3 mm |
| |
Stiffener (PI/PET/FR-4Supporting board) |
± 0.3 mm |
| |
Tape/Adhesive |
± 0.3 mm |
|
| Surface treatment |
Solder plating (Sn/Pb) |
2 ~ 10
μm |
| |
Tin immersion |
0.5 ~ 1
μm |
| |
HASL |
2 ~ 10
μm |
| |
Tin/Lead printed |
60 ~ 120
μm |
| |
Cupper Plating |
2 ~ 10
μm |
| |
Electrolytic gold Plating |
Au : 0.03 ~ 0.4 μm； Ni : 2 ~ 8
μm |
| |
Electrolytic-free gold Plating |
Au : 0.03 ~ 0.15 μm； Ni : 2 ~ 6
μm |
| |
FLUX |
|
|
| Printing |
Matte/glossy white ink |
Min text width 1mm |
| |
Matte/glossy black ink |
Min text width 0.2mm |
| |
Insulated black ink |
Deviation ± 0.5mm |
| |
Silver paste
|
Deviation ± 0.5mm |
| |
Yellow
ink
|
Deviation–general ± 0.5mm；special ± 0.1mm |
| |
Green ink |
Deviation–general ± 0.5mm；special ± 0.1mm |
|
| Punching |
Min hole punching |
0.5
mm |
| |
Hole punching tolerance |
± 0.05 mm |
| |
Outline tolerance |
± 0.07 mm |
| |
Deviation tolerance |
± 0.07 mm |
|
|
| Number of layer |
Flexible boards |
6 layers |
| |
Rigid-Flex boards |
6 layers |